A research team led by Su-Min Kim and Jung-Goo Lee (Korea Institute of Materials Science; KIMS) has developed next-generation ...

Liquid-phase bonding relies on the formation of a transient liquid film at the interface which reduces the requirement for accurate fit-up and also accelerates the diffusion process. With solid state ...

Diffusion bonding is a solid-state joining method in which atomic diffusion across meticulously cleaned and prepared metal surfaces under elevated temperature and pressure produces a continuous ...

A new technical paper titled “Understanding and Optimizing Oxygen Plasma Treatment for Enhanced Cu-Cu Bonding Application” was published by researchers at Seoul National University of Science and ...