Abstract: The gallium-nitride (GaN) high-electron-mobility transistors (HEMT) devices have great potential for high-power, high-temperature, and high-frequency applications. However, it is challenging ...
YES Selected to Deliver Full Portfolio of Advanced Packaging Tools for Glass Panel AI and HPC Applications by a Leading AI Infrastructure Supplier Yield Engineering Systems (YES), a leading provider ...
Ohio University’s Honors Tutorial College (HTC) is now accepting applications for two Faculty Fellow positions and for the Faculty Fellow for Wellness position. Applications for these positions are ...
Creative Commons (CC): This is a Creative Commons license. Attribution (BY): Credit must be given to the creator. The demand for sustainable alternatives to synthetic plastics increases, driving ...
Harris started looking for his first real job months before his graduation from UC Davis this spring. He had a solid résumé, he thought: a paid internship at a civic-consulting firm, years of ...
Forbes contributors publish independent expert analyses and insights. Caroline Castrillon covers career, entrepreneurship and women at work. AI is transforming the job application process, with more ...
Amazon is changing how it boxes packages, swapping out plastic air pillows with recycled paper, a move the company says is more eco-friendly and will provide just as much protection, "if not better." ...
The latest macOS Beta update is here, and with it comes a significant change: the beloved Launchpad is out, replaced by a new Applications interface deeply integrated within Spotlight. This shift has ...
Give your holiday cake slices a festive flair with this creative packaging tutorial! From simple wraps to eye-catching ribbons and DIY boxes, learn how to turn every slice into a beautiful edible gift ...
eSpeaks’ Corey Noles talks with Rob Israch, President of Tipalti, about what it means to lead with Global-First Finance and how companies can build scalable, compliant operations in an increasingly ...
TL;DR: Apple is collaborating with TSMC to adopt advanced WMCM and SoIC packaging technologies for its next-generation A20 and server chips in 2026. These innovations enable ultra-dense chip stacking, ...
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